EDWinXP is a CAD/CAE software package providing an electronics engineer with computerised tools to produce an electronic circuit in the form of a schematic diagram and/or PCB layout. Using EDWinXP provides documentation and artworks for manufacturing printed circuit boards. EDWinXP features seamless integration between all its modules – namely Schematic Capture, Layout Design, Post Processing and Simulation, which is possible thanks to a unique, totally integrated design database structure facilitating automatic front and back annotation.
The power features of EDWinXP are given below.
- Up to 100 Schematic Sheets
- Up to 64″ x 64″ Sheet Size
- Repeat, rotate, mirror and scale components with different colours
- Real time dragging of components and wires
- Automatic package and pin assignment
- Orthogonal & free mode manual routing
- Automatic bus annotation
- Block save, load, move & delete
- Direct access to mixed mode simulation
- Auto-routing of connections
- Merging and splitting of nets possible
- Definable line width
- Swapping of component positions
- Automatic component renumbering by swapping
- Database viewer
- Bitmap facility
- 32 layers (28 route layers, 2 silk screen layers, 2 solder mask layers)
- User definable trace sizes, pads
- Curved traces
- 1 mil grid resolution
- SMT, fine-line, analog support
- Component repeat, rotate, mirror
- Auto-placement of components
- Eight different grid types for autoplacement
- Direct access to auto-routers
- Automatic component renaming
- Trace repeat
- On-line multi-layer routing with automatic via insertion
- Pin-to-pin, free or 45 degree routing
- Change segment side and width, trace side and width
- Fast interactive generation of ground planes with user definable cross hatch or solid fill
- Automatic ground plane with thermal relief insertion
- Automatic DRC with user specified parameters
- Electrical connectivity checking and clearance check
- Linear rotation of symbols
- Gerber input read and use possibility
- Database viewer
- Built-in interface for Specctra, Maxroute and Arizona Auto-routers
- Bitmap functions
- All the functions needed for manufacturing, photoplotting and other outputs
- Industry standard GERBER outputs, NC Drill outputs
- Effortless fabrication drawing
- Bill of material output
- Artwork for photo plotting
- Options for panelisation, composites, air gap plots(for power, ground planes)
- Gerber Viewer for on screen viewing of artwork in WYSIWYG (What You See Is What You Get) format
- AC analysis (Frequency domain)
- DC analysis (Linear/non-linear)
- TD analysis (Time domain)
- Diagram generator
- Dynamic parameter definition of active and passive components
- Output graphs displayed on screen, hard copy or placed on schematic
- Oscilloscope function
- DLL based analog/digital simulation primitives, modelling language and library creation tools
- Built-in model generator for discrete devices
- Interactive routines for user management, validation, updating and enhancement of standard libraries
- Create new parts in seconds
- Most complete libraries in the market included
- Select your own working standard, from ANSI, IEC and PROSAM
- Easy to use symbol and footprint editor
- Easy conversion of symbols from EE-Designer III
The new feature of EDWin XP/2000 includes Oscillograph. This applies to Mixedmode simulator. It provides a window where the outputs of the variables like voltage, current and logic states may be viewed graphically when simulation is carried out. This function works like CRO where the variable (voltage, current, Logic states) may be selected and output obtained graphically with respect to time. Applicable for both Analog and Digital circuits for Time Domain Analysis.
Set the required test points for the circuit and click Run Transient analysis (Oscillograph) from Simulation menu in Mixedmode Simulator. A window OSCILLOGRAPH-Transient Analysis pops up where the required variable (voltage, current, Logic states) is selected. Set the scale factor for the X and Y-axis. The scale factor is determined by multiplying the value X/div multiplied by the times selected in the multiply combo. Similarly, the scale along the Y-axis is also calculated. The Step Time is given suitably.
The step time determines the iteration time. Initialize LC allows manipulating the initial values of the state variables (capacitor voltages and inductance currents). Click the start button in the window and observe the graph. If necessary the scale values may be changed to find the amplitude. The display of the output can be paused or stopped. During the simulation, the variables can be changed and the output obtained changes accordingly.
ADVANCED SPICE SIMULATION
EDSpice is a SPICE-like simulator giving improved performance over SPICE2 based simulators. It is solely based on Berkeley SPICE3 with a number of extensions and improvements. Featured are ten types of analyses with improved convergence algorithms (including Gmin and Source Stepping) and an extended set of built in models such as Resistors, Capacitors, Inductors, Coupled Inductors, Diodes, BJTs, JFETs, MOSFETs [level 1, 2, 3, 4 (BSIM1), 5 (BSIM2) and 6], MESFETs, Subcircuits, Ideal Transmission Lines, two types of Lossy Transmission Lines, Independent/Dependent Voltage/Current sources (Including SPICE 2 polynomials and B element), Voltage/Current Controlled switches and Semiconductor Resistor / Capacitor.
- Interactively cross-probe voltages, currents and logic states by clicking on the Schematic
- Component values and parameters can be interactively modified and the circuit re-simulated without the need for netlist regeneration
- Interactively measure internal device parameters such as currents through a device or power dissipated by a device and view the results straight away
- EDSpice gives access to more internal device parameters of built-in models than any SPICE2-based simulators
- Extract SPICE model lines and sub-circuits, from existing netlists, to be saved in special libraries
- Hierarchical schematics are directly translated into SPICE netlists syntax preserving the hierarchy
- EDSpice has an extended set of built-in models, which feature all the standard SPICE2 models, such as Resistors, Capacitors, Inductors, Coupled Inductors, Diodes, BJTs, JFETs, MOSFETs [level 1, 2, 3, 4 (BSIM1), 5 (BSIM2) and 6], MESFETs, sub-circuits, Ideal transmission lines, two types of Lossy transmission lines, Independent / Dependent Voltage / Current sources (Including SPICE 2 polynomials and B element), Voltage / Current Controlled switches, Semiconductor Resistor / Capacitor.
- EDSpice offers ten types of analyses such-as DC Operating Points, DC Transfer Curve (DC Sweep), Transfer Function, AC (including Bode Plots) Transient (Time Domain), Fourier, Pole Zero, Distortion, Noise, AC and DC Sensitivity, Temperature.
- EDSpice accepts Berkeley SPICE2, SPICE3 or XSPICE netlist formats.
- Temperature can be set on individual and circuits, This allows you to simulate a ‘hot’ component or make temperature a function of the device’s power dissipation.
- Improved convergence algorithms (Gmin/Source Stepping)
- Circuit size is limited only by memory.
- EDSpice offers mixed-mode simulation capabilities
- EDSpice supports Code models and user-defined notes
- EDSpice offers SPICE2 G6 polynomial source compatibility, which are not available on SPICE3 simulators.
- Arbitrary plane independent sources are supported that output, at time zero, a value corresponding to some user specified phase shift.
- A supply ramping function has been provided in EDSpice as an option to a Transient analysis to simulate the turn-on of power supplies to a board level circuit.
- Additional matrix conditioning support is provided to aid convergence
The Thermal Analyser, EDTherm is a plug-in tool for the EDWinXP ECAD package that enables you to perform comprehensive thermal analysis of your PCB designs. The Thermal Analyser requires a thermal library (provided as part of the package) containing the thermal parameters of Devices. Users can easily add to the library by editing the appropriate ASCII file and compiling it using the library compiler to create the corresponding thermal library.
Board thermal parameters such as board emissivities, insulator thermal conductivities, board orientations etc., Environmental parameters such as working maximum, minimum and ambient temperatures as well as cooling parameters such as direction and velocity of air flow can also be specified by the user.
Simulation parameters such as isotherm density, colours used for the colour maps, etc. can be specified.
The View menu allows you to tailor the visual presentation of the simulation results as per your requirements. You can choose to view isotherms, coloured maps of any one of the 32 layers that you create using EDWinXP. You can also choose to view isotherms with any gradation, a coloured map of the whole board or components with any temperature range. In other words you gain the freedom to view the results in the most meaningful manner to you, the designer.
- Change electrical parameters (Voltage & frequency) of nets
- Setup colours for electromagnetic field display
- Setup field calculation parameters
- Setup isolines density
- Execute electromagnetic analysis
ADVANCED SYSTEM OPTIONS
- Complete end-to-end CAE/CAD system
- Simultaneous schematic and layout generation
- Automatic front and back annotation
- Intuitive hierarchical menu structure
- Mouse or keyboard command activation
- Macro operation
- Real time display of rats-nest, active nodes, single line or true trace width
- On-line Help
- Auto Reconnect
- Full integration of Schematic and Layout
- Automatic File backup
- User definable text sizes
- Mixed Metric and Imperial units
- Screen Hard Copy
- Library Viewer with editing facility
- Monochrome mode for better print resolution